Porous Ortho Implants for Quick Healing and Improved Biomechanics

ortho-implantAt McGill University in Canada, researchers have been working on orthopedic technology that will improve the performance of hip and other bone implants. The investigators developed a fine microstructure within a titanium femoral stem that mimics the porosity of real bones. This varying porous structure promotes tissue growth into the implant, helping to establish the device quickly within the body and heal the affected area soon after implantation.

Because it is so porous, the implant is actually quite light. Yet, similar to I-beams used in the construction trade, the implants turn out to be stronger while using less material than a solid implant. Many currently available implants have porous surfaces, which has been an available characteristic for a number of years now. The new implant is porous throughout, resulting in a less brittle product that behaves more like a real bone and channels a lot of the energy that it absorbs into the bone it’s designed to sit inside.

By medGadget

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About Peter Coffaro 1091 Articles
A growth-driven and strategic executive, Peter Coffaro commands more than 20 years of progressive management success within the medical device industry. As a District Sales Manager for Stryker Orthopaedics, Peter was responsible for managing and directing a regional sales force to achieve sales and profit goals within the Rocky Mountain region. Previously, he was the Director of Sales & Marketing for Amp Orthopedics. In this role, Peter was responsible for planning, developing, and leading all sales and marketing initiatives. Peter is a former orthopedic distributor in the Pacific Northwest. He has also worked with DePuy Orthopaedics as well as Zimmer, and held positions in sales, sales training, and sales management. Peter has an extensive background in organizational development, business development, sales management, negotiating and P&L management. Peter holds a B.S. degree in Biology from Northern Illinois University.

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